• Advanced Etching & Stripping for CMOS

    Plasma etching and stripping for FEOL (STI, Finfet, spacer, metal gate,...)
    Plasma etching and stripping for MEOL (contact, self aligned contact)
    Plasma etching and stripping for BEOL application (ULK trenches and vias)
  • Etching and Stripping for more than Moore applications

    Plasma etching and stripping for MEMS, bio MEMS, imagers, photonics
    Plasma etching and stripping for 3D IC
  • Plasma fundamentals

    New Plasma Sources
    Advanced plasma diagnostics
    Plasma surface interactions
    Plasma Modeling
  • New Processes/New materials

    Patterning with alternative lithography (di-block copolymer, EUV resist…)
    Plasma etching and stripping for III-V materials (HEMT, CMOS, ...)
    Plasma etching and stripping for memories (MRAM, OXRAM, PCRAM, CBRAM...)
    New etch concept (Atomic Layer Etching, Self-limiting etching)
    Plasma for alternative technologies (biotechnology, PV….)
  • Registration
    INSIGHT OUTSIDE
    39 chemin du vieux chêne
    38240 Meylan
    Tel: +33 825 595 525 (0,15€/min*)
    Fax: +33 4 38 38 18 19
    Information desk
    monday to friday from 2pm to 5pm
    Organization
    CEA-Leti
    17 Rue des Martyrs
    38054 Grenoble Cedex
    +33 438 782 921
    Sébastien BARNOLA
     

    (*) Prices starting from fixed line incumbent, a surcharge may be applied by operators, counting the second after the first 45 seconds.

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